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Amkor Technology - Semiconductor IC Packaging, Design …

    https://amkor.com/
    Amkor Technology, Inc. is one of the world’s largest providers of outsourced (OSAT) semiconductor packaging, design, and test services. This site uses cookies. By continuing to browse this site, you are agreeing to our use of cookies. Find out more here. X. English;

Amkor Moves Corporate Headquarters to Chandler, …

    https://ir.amkor.com/news-releases/news-release-details/amkor-moves-corporate-headquarters-chandler-arizona
    Amkor pioneered the Outsourced Semiconductor Assembly and Test (OSAT) industry in 1968, and the company first established its presence in the Greater Phoenix area in 1984. Since then Amkor has increasingly focused its corporate executive staff, product management, engineering support and business development teams at its Chandler location. ...

Amkor Corporate Headquarters, Office Locations and …

    https://craft.co/amkor/locations
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Amkor Technology, Inc. Office Locations and …

    https://www.zippia.com/amkor-technology-careers-723/locations/
    Amkor Technology, Inc. may also be known as or be related to Amkor Technology, Amkor Technology Inc, Amkor Technology Inc., Amkor Technology is a strategically located company with a diversified working environment. Employees mention free lunches, transportation, and lodging, and the management is good at recognizing key talents. and Amkor ...

Amkor Corporate Headquarters | Ryan Companies

    https://www.ryancompanies.com/project/amkor-corporate-headquarters
    Amkor Technology, Inc. Submitted by jen on Thu, 01/26/2017 - 14:39. We are excited to move our corporate headquarters to the prestigious ASU Research Park. The new building is a beautiful, state-of-the-art facility and we look forward to being here for many years to come. Steve Kelley, President and CEO, Amkor Technology, Inc.

Amkor Company Profile - Office Locations, Competitors, …

    https://craft.co/amkor
    Amkor Technology is a provider of outsourced semiconductor packaging and test services for chip-specific applications. It offers laminate-based, leadframe, power discrete, and wafer-level packages as well as semiconductor technology such as Through silicon via, Through mold via, System in package, copper wire bond, and copper pillar.

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